Release of the “VP9000LD” dual lane 3D solder paste inspection machine

CKD Corporation (Headquarters: Komaki City, Aichi, Japan, President: Katsuhito Okuoka) is a manufacturer of solder paste inspection machines that inspect the solder paste used in the PCB mounting process and realizes top level accuracy and speed in the industry in Japan. The company will release the “VP9000LD” dual lane 3D solder paste inspection machine on October 17, 2024.

* What is a “dual lane” machine?
Mounting equipment with two independent transport lanes on one machine. Two boards can be processed in parallel at the same time, increasing productivity.

1．Development background
The proportion of dual lane machines in the PCB mounting industry is tending to expand globally aimed at the improvement of productivity. CKD will release a dual-lane machine in the “VP9000 Series” of 3D solder paste inspection machines, which was launched in 2020, to respond to this demand.

2．Main applications
3D inspection of cream solders used on PCBs, etc.

3．Product features
(1) VP9000 Series dual lane machine
We will add a dual lane machine to the VP9000 Series lineup.

(2) A multi-resolution switching function is provided as standard.
Resolution can be switched at the part level to suit the size of the subject of inspection. Conventional two-step switching has been expanded to three-step switching, an industry first for a dual-lane machine.

(3) A foreign matter inspection function is provided as standard.
A function to detect the presence or absence of foreign matter attached to boards at the same time as the solder paste inspection is provided as standard.

(4) Compliant with the CE standard
Because this product will be sold worldwide, CE marking, which has not been supported by previous dual-lane machines, is now provided as standard. In addition, we have investigated all parts and no substances with a high-environmental impact have been used.

(5) User interface
We renewed the operating screen in tune with that of the VP9000 Series and turned it into a large monitor. We incorporated a color design with increased visibility and a dashboard for the inspection settings to improve user-friendliness.

(6) Mechanical structure
We changed the power sources for transport and up-down clamp movement to individual power sources for each lane to improve accessibility to, and the maintainability of, each lane. In addition, by changing the main frame to a braced structure, we improved the rigidity of the main frame, which contributes to the stable operation of inspections.

4. Main specifications
(1) Inspected substrates : Glass epoxy, paper phenol, polyimide film base
(2) Substrate shape (L x W) : 50 mm × 50 mm – 510 mm × 330 mm
(3) Substrate thickness : 0.3 mm – 5.0 mm
(4) Inspection resolution : 25 μm, 20 μm, 15 μm
(5) Accuracy (volume 3σ) : 3% (high speed machine), 2% (standard machine)
(6) Inspection speed : 0.272 s/field of view or less (25 µm resolution, high-speed machine, in standard mode)

5．Selling price (excluding tax)
List price 15 million yen

6．Sales plan
FY2027: 212 million yen

7．Release date
October 17, 2024

8．Product photo