{"id":171,"date":"2024-11-18T14:59:02","date_gmt":"2024-11-18T05:59:02","guid":{"rendered":"https:\/\/www.ckd.co.jp\/auto\/en\/?post_type=repo&#038;p=171"},"modified":"2024-11-19T10:45:55","modified_gmt":"2024-11-19T01:45:55","slug":"repo-02","status":"publish","type":"repo","link":"https:\/\/www.ckd.co.jp\/auto\/en\/repo\/repo-02\/","title":{"rendered":"BGA quality assurance in the age of miniaturization"},"content":{"rendered":"\n<section id=\"eye_catch\" class=\"simple_title\">\n<h1 class=\"title_line\">Case Studies<\/h1>\n<\/section>\n\n\n\n<section id=\"breadcrumbs\">\n<ul>\n<li><a href=\"https:\/\/www.ckd.co.jp\/auto\/en\">Home<\/a><\/li>\n<li><a href=\"https:\/\/www.ckd.co.jp\/auto\/en\/repo\">Case Studies<\/a><\/li>\n<li>BGA quality assurance in the age of miniaturization<\/li>\n<\/ul>\n<\/section>\n\n\n\n<div class=\"title-box\">\n<h2 class=\"title_large left\">Quality assurance for the miniaturization era<br>3D solder paste inspection of BGA pad<\/h2>\n<\/div>\n\n\n\n<div class=\"repo_data_list\">\n<dl>\n<dt>Industry\/Business Type<\/dt>\n<dd>Electronic devices and components, electronic device manufacturers and contract manufacturing services (EMS)<\/dd>\n<\/dl>\n<dl>\n<dt>Installed product<\/dt>\n<dd>VP9000<\/dd>\n<\/dl>\n<dl>\n<dt>Related Tags<\/dt>\n<dd>3D solder paste inspection machine \/ BGA inspection \/ multi-resolution switching function<\/dd>\n<\/dl>\n<\/div>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"title-box\">\n<h4 class=\"title_small left_line\">Contact details \/ CKD Automatic Machinery<\/h4>\n<\/div>\n\n\n\n<div class=\"repo_profile\">\n<dl>\n<dt><img decoding=\"async\" class=\"alignnone size-medium wp-image-351\" src=\"https:\/\/www.ckd.co.jp\/auto\/wp-content\/uploads\/2024\/08\/repo_pro01.png\" alt=\"Mr. Takayuki Harada, Marketing Dept. Gr.1, Machinery Sales Dept., Automatic Machinery Business Division\"><\/dt>\n<dd>This case study introduces an example of how our customers who were having problems were able to feel the benefits of introducing our products, which led to improvement of the product quality and production efficiency of our customers.<br><br>Mr. Takayuki Harada, Marketing Dept. Gr.1, Machinery Sales Dept., Automatic Machinery Business Division<\/dd>\n<\/dl>\n<\/div>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"title-box\">\n<h2 class=\"title_large left\">Customer Challenges<\/h2>\n<\/div>\n\n\n\n<div class=\"title-box\">\n<h3 class=\"title_medium\">Protecting Invisible Quality: Overcoming the Challenges of Miniaturization Components and BGA Inspection<\/h3>\n<\/div>\n\n\n\n<div class=\"normal_text-box\">\n<p>Board mounting manufacturers, who had relied on conventional automatic visual inspection (AOI), were challenged with miniaturization of parts and quality assurance of BGA (Ball Grid Array). A new inspection method was needed to ensure the quality of BGAs, which are difficult to visually inspect, and for which solder joints cannot be seen after mounting.<\/p>\n<\/div>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"title-box\">\n<h2 class=\"title_large left\">Effects of Deploying VP9000<\/h2>\n<\/div>\n\n\n\n<div class=\"normal_text-box\">\n<p>With the introduction of VP9000, it was possible to control the mounting quality of fine parts and BGAs from the solder printing process, which was difficult after the component mounting process, leading to improved quality control and lowering the defect rate of BGAs. In addition, the multi-resolution switching function enables high-speed and high-precision solder inspection of the entire circuit board, enabling smooth in-line inspection. As a result, the efficiency of the entire manufacturing process is improved, contributing to the improvement of product quality.<\/p>\n<\/div>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"title-box\">\n<h3 class=\"title_medium\">1.BGA Quality assurance<\/h3>\n<\/div>\n\n\n\n<div class=\"normal_text-box\">\n<p>With the introduction of VP9000, it is now possible to inspect all-number, three-dimensional fine solder pads prior to BGA mounting. This ensures the quality of the BGA.<\/p>\n<\/div>\n\n\n\n<div class=\"title-box\">\n<h3 class=\"title_medium\">2. Achieving high-precision inspection<\/h3>\n<\/div>\n\n\n\n<div class=\"normal_text-box\">\n<p>By making use of the \u201cmulti-resolution switching function\u201d, one of the biggest features of VP9000, it has become possible to inspect fine pads for BGAs with high accuracy and accuracy. This has dramatically improved the quality control of fine parts.<\/p>\n<\/div>\n\n\n\n<div class=\"title-box\">\n<h3 class=\"title_medium\">3. Gain an efficient inline inspection system<\/h3>\n<\/div>\n\n\n\n<div class=\"normal_text-box\">\n<p>Solder inspection of the entire circuit board is possible at a high speed, enabling smooth in-line quality control. This improves the efficiency of the entire manufacturing process.<\/p>\n<\/div>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"title-box\">\n<h2 class=\"title_large left\">Features Introduced in Case Studies<\/h2>\n<\/div>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-1 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-vertically-aligned-stretch is-layout-flow wp-block-column-is-layout-flow\">\n<div class=\"card-box noShadow inner_text\"><span class=\"img-box\"><img decoding=\"async\" src=\"https:\/\/www.ckd.co.jp\/auto\/wp-content\/uploads\/2024\/11\/repo_i02_tittle01_i01_en.png\" alt=\"Multi-resolution switching function\" \/><\/span>\n<p class=\"text-box\"><strong>Multi-resolution switching function<\/strong>Compared with the conventional inspection (made by other companies) which only has fine resolution, the inspection speed is extremely different.<\/p>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-stretch is-layout-flow wp-block-column-is-layout-flow\">\n<div class=\"card-box noShadow inner_text\"><span class=\"img-box\"><img decoding=\"async\" src=\"https:\/\/www.ckd.co.jp\/auto\/wp-content\/uploads\/2024\/11\/repo_i02_tittle02_i02_en.png\" alt=\"Z-axis compensation function\"><\/span>\n<p class=\"text-box\"><strong>Z-axis compensation function<\/strong>To inspect multilayer substrates for each reflow, CKD\u2019s solder print inspection machine is an SPI inspection machine and can also handle AOI\u2019s warpage inspection.<\/p>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-stretch is-layout-flow wp-block-column-is-layout-flow\">\n<div class=\"card-box noShadow inner_text\"><span class=\"img-box\"><img decoding=\"async\" src=\"https:\/\/www.ckd.co.jp\/auto\/wp-content\/uploads\/2024\/11\/repo_i01_en.png\" alt=\"Measuring to the grounding surface of solder and circuit board\"><\/span>\n<p class=\"text-box\"><strong>Measuring to the grounding surface of solder and circuit board<\/strong>Solder in low-altitude areas close to the ground surface can be accurately measured with the VP Series.<\/p>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-columns btn-column-box is-layout-flex wp-container-core-columns-is-layout-2 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-vertically-aligned-stretch is-layout-flow wp-block-column-is-layout-flow\">\n<div class=\"btn_area\"><a class=\"btn arrow_icon\" href=\"https:\/\/www.ckd.co.jp\/auto\/en\/machine\/vp-series\/\">View product details<\/a><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-stretch is-layout-flow wp-block-column-is-layout-flow\">\n<div class=\"btn_area\"><a class=\"btn arrow_icon\" href=\"https:\/\/www.ckd.co.jp\/auto\/en\/repo\/\">Case Study List<\/a><\/div>\n<\/div>\n<\/div>\n\n\n\n<div style=\"height:160px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n","protected":false},"featured_media":0,"template":"","meta":{"_acf_changed":false},"auto_machine_repo_category":[14],"acf":[],"_links":{"self":[{"href":"https:\/\/www.ckd.co.jp\/auto\/en\/wp-json\/wp\/v2\/repo\/171"}],"collection":[{"href":"https:\/\/www.ckd.co.jp\/auto\/en\/wp-json\/wp\/v2\/repo"}],"about":[{"href":"https:\/\/www.ckd.co.jp\/auto\/en\/wp-json\/wp\/v2\/types\/repo"}],"wp:attachment":[{"href":"https:\/\/www.ckd.co.jp\/auto\/en\/wp-json\/wp\/v2\/media?parent=171"}],"wp:term":[{"taxonomy":"auto_machine_repo_category","embeddable":true,"href":"https:\/\/www.ckd.co.jp\/auto\/en\/wp-json\/wp\/v2\/auto_machine_repo_category?post=171"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}